{"id":139867,"date":"2025-11-17T16:18:13","date_gmt":"2025-11-17T16:18:13","guid":{"rendered":"https:\/\/kamucalisani.net\/?p=139867"},"modified":"2025-11-17T16:18:13","modified_gmt":"2025-11-17T16:18:13","slug":"intelin-gelismis-paketleme-teknolojileri-apple-ve-qualcommun-dikkatini-cekti","status":"publish","type":"post","link":"https:\/\/kamucalisani.net\/index.php\/2025\/11\/17\/intelin-gelismis-paketleme-teknolojileri-apple-ve-qualcommun-dikkatini-cekti\/","title":{"rendered":"Intel\u2019in geli\u015fmi\u015f paketleme teknolojileri Apple ve Qualcomm\u2019un dikkatini \u00e7ekti"},"content":{"rendered":"

<\/span> Y\u00fcksek performansl\u0131 bili\u015fim standart haine gelirken, \u00e7ip \u00fcreticileri yaln\u0131zca Moore Yasas\u0131\u2019na dayal\u0131 geli\u015ftirmelerle talepleri kar\u015f\u0131lamakta zorlan\u0131yor. Bu ba\u011flamda AMD ve Nvidia gibi \u015firketler, tek bir paket i\u00e7inde birden fazla \u00e7ip bar\u0131nd\u0131rabilen geli\u015fmi\u015f paketleme teknolojilerini benimseyerek hem \u00e7ip yo\u011funlu\u011funu hem de platform performans\u0131n\u0131 art\u0131rmay\u0131 tercih ediyor. Intel<\/strong> ise \u00fcretim s\u00fcre\u00e7lerinde geride kalsa da geli\u015fmi\u015f paketleme taraf\u0131nda rekabet\u00e7i bir konumda bulunuyor. EMIB<\/strong> ve Foveros<\/strong> \u00e7\u00f6z\u00fcmleri, TSMC\u2019nin sundu\u011fu se\u00e7eneklere g\u00fc\u00e7l\u00fc bir alternatif olarak \u00f6ne \u00e7\u0131karken, tasar\u0131mc\u0131lar\u0131n artan ihtiya\u00e7lar\u0131 a\u00e7\u0131s\u0131ndan kritik \u00f6nem ta\u015f\u0131yor. <\/figure>\n

Apple ve Qualcomm olduk\u00e7a ilgili<\/b><\/p>\n

Apple<\/strong> ve Qualcomm<\/strong>\u2019un yeni i\u015f ilanlar\u0131, her iki \u015firketin de Intel\u2019in EMIB teknolojisine hakim uzmanlar arad\u0131\u011f\u0131n\u0131 g\u00f6steriyor. Apple CoWoS, EMIB, SoIC ve PoP gibi ileri paketleme teknolojilerinde deneyimli bir DRAM paketleme m\u00fchendisi ararken, Qualcomm da EMIB bilgisine sahip adaylar istiyor. Bu durum, sekt\u00f6rde Intel\u2019in paketleme \u00e7\u00f6z\u00fcmlerine ciddi bir ilgi oldu\u011funu ortaya koyuyor.<\/p>\n

<\/span> Intel\u2019in paketleme teknolojilerine k\u0131sa bir bak\u0131\u015f atacak olursak, EMIB<\/strong> (Embedded Multi-Die Interconnect Bridge), bir paket i\u00e7inde birden fazla \u00e7ipi k\u00fc\u00e7\u00fck bir silikon k\u00f6pr\u00fc arac\u0131l\u0131\u011f\u0131yla ba\u011flayarak b\u00fcy\u00fck interposer ihtiyac\u0131n\u0131 ortadan kald\u0131r\u0131yor. Bu y\u00f6n\u00fcyle TSMC\u2019nin CoWoS<\/strong> \u00e7\u00f6z\u00fcm\u00fcnden ayr\u0131l\u0131yor. EMIB \u00fczerine in\u015fa edilen Foveros Direct 3D<\/strong> paketleme teknolojisi ise TSV\u2019ler kullanarak alt yonga \u00fczerinde \u00fcst \u00fcste \u00e7ip yerle\u015ftirmeye imkan tan\u0131yor. <\/figure>\n

TSMC y\u00fcksek sipari\u015f hacmi nedeniyle ileri paketleme \u00fcretiminde tedarik s\u0131k\u0131\u015f\u0131kl\u0131\u011f\u0131 ya\u015f\u0131yor ve yeni m\u00fc\u015fteriler nispeten daha d\u00fc\u015f\u00fck \u00f6ncelik al\u0131yor. Intel\u2019in bu ilgiyle kar\u015f\u0131la\u015fmas\u0131n\u0131n nedeni yaln\u0131zca ka\u011f\u0131t \u00fczerinde TSMC\u2019ye alternatif sunmas\u0131 de\u011fil ayn\u0131 zamanda di\u011fer \u015firketlere hareket alan\u0131 tan\u0131mas\u0131yla da ilgili.<\/p>\n\n

Kaynak\u00a0 :\u00a0https:\/\/www.donanimhaber.com\/intel-in-ileri-paketleme-cozumleri-apple-ve-qualcomm-un-radarinda–198662<\/span><\/p>\n","protected":false},"excerpt":{"rendered":"

Y\u00fcksek performansl\u0131 bili\u015fim standart haine gelirken, \u00e7ip \u00fcreticileri yaln\u0131zca Moore Yasas\u0131\u2019na dayal\u0131 geli\u015ftirmelerle talepleri kar\u015f\u0131lamakta zorlan\u0131yor. Bu ba\u011flamda AMD ve Nvidia gibi \u015firketler, tek bir paket i\u00e7inde birden fazla \u00e7ip bar\u0131nd\u0131rabilen …<\/p>\n","protected":false},"author":1,"featured_media":139868,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[8],"tags":[480,1233,3211,506],"class_list":["post-139867","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-teknoloji","tag-cip","tag-intel","tag-paket","tag-tek"],"_links":{"self":[{"href":"https:\/\/kamucalisani.net\/index.php\/wp-json\/wp\/v2\/posts\/139867","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/kamucalisani.net\/index.php\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/kamucalisani.net\/index.php\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/kamucalisani.net\/index.php\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/kamucalisani.net\/index.php\/wp-json\/wp\/v2\/comments?post=139867"}],"version-history":[{"count":1,"href":"https:\/\/kamucalisani.net\/index.php\/wp-json\/wp\/v2\/posts\/139867\/revisions"}],"predecessor-version":[{"id":139871,"href":"https:\/\/kamucalisani.net\/index.php\/wp-json\/wp\/v2\/posts\/139867\/revisions\/139871"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/kamucalisani.net\/index.php\/wp-json\/wp\/v2\/media\/139868"}],"wp:attachment":[{"href":"https:\/\/kamucalisani.net\/index.php\/wp-json\/wp\/v2\/media?parent=139867"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/kamucalisani.net\/index.php\/wp-json\/wp\/v2\/categories?post=139867"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/kamucalisani.net\/index.php\/wp-json\/wp\/v2\/tags?post=139867"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}