{"id":60010,"date":"2024-06-26T13:36:07","date_gmt":"2024-06-26T13:36:07","guid":{"rendered":"https:\/\/kamucalisani.net\/?p=60010"},"modified":"2024-06-26T13:36:07","modified_gmt":"2024-06-26T13:36:07","slug":"samsung-gelecek-yil-icin-hbm4e-hazirlaniyor-ve-saint-dyi-tanitiyor-2","status":"publish","type":"post","link":"https:\/\/kamucalisani.net\/index.php\/2024\/06\/26\/samsung-gelecek-yil-icin-hbm4e-hazirlaniyor-ve-saint-dyi-tanitiyor-2\/","title":{"rendered":"Samsung, gelecek y\u0131l i\u00e7in HBM4\u2019e haz\u0131rlan\u0131yor ve SAINT-D’yi tan\u0131t\u0131yor"},"content":{"rendered":"

<\/span> \u015eirket ve sekt\u00f6r kaynaklar\u0131na g\u00f6re Samsung<\/strong>, bu y\u0131l i\u00e7inde y\u00fcksek bant geni\u015flikli bellek (HBM) i\u00e7in \u00fc\u00e7 boyutlu (3D) paketleme <\/strong>hizmetlerini ba\u015flatmas\u0131 ve bu teknolojinin yeni nesil HBM4 <\/strong>belleklerde kullan\u0131lmas\u0131 bekleniyor. Samsung, bu noktada ba\u015far\u0131l\u0131 olabilirse yapay zeka trendinden istedi\u011fi geliri elde edebilir. <\/figure>\n

D\u00fcnyan\u0131n en b\u00fcy\u00fck bellek yonga \u00fcreticisi olsam Samsung, ABD\u2019de d\u00fczenledi\u011fi SFF 2024<\/strong>\u2019te son yonga paketleme teknolojisini ve hizmet yol haritalar\u0131n\u0131 a\u00e7\u0131klad\u0131. B\u00f6ylelikle Samsung, HBM <\/strong>yongalar\u0131 i\u00e7in 3D paketleme teknolojisini <\/strong>ilk kez halka a\u00e7\u0131k bir etkinlikte duyurdu. Bu \u00f6nemli zira, \u015fu anda HBM \u00e7ipleri \u00e7o\u011funlukla 2.5D teknolojisi ile paketleniyor.<\/p>\n

HBM4 muhtemelen Nvidia’n\u0131n 2026 y\u0131l\u0131nda piyasaya \u00e7\u0131kmas\u0131 beklenen yeni R100 Rubin GPU<\/strong> modeline yerle\u015ftirilecek. Nvidia, Rubin\u2019i yakla\u015f\u0131k iki hafta \u00f6nce Tayvan\u2019daki Computex esnas\u0131nda duyurmu\u015ftu. Rubin, TSMC’<\/strong>nin daha yeni N3 <\/strong>d\u00fc\u011f\u00fcm\u00fcn\u00fc ve yeni CoWoS-L<\/strong> geli\u015fmi\u015f paketlemesini kullanarak 2025 y\u0131l\u0131n\u0131n 4. \u00e7eyre\u011finde seri \u00fcretime girecek. Rubin R100 AI GPU’lar\u0131 2026’da piyasaya s\u00fcr\u00fclecek. Dolay\u0131s\u0131yla bu GPU\u2019larda yer alacak HBM4 i\u00e7in Samsung, Micron ve SK Hynix b\u00fcy\u00fck bir yar\u0131\u015f<\/strong> i\u00e7erisinde.<\/p>\n

Samsung, HBM4 i\u00e7in b\u00fcy\u00fck oynuyor<\/b><\/p>\n

Samsung’un en yeni paketleme teknolojisi, h\u0131zla b\u00fcy\u00fcyen yapay zeka \u00e7ip pazar\u0131nda oyunun kurallar\u0131n\u0131 de\u011fi\u015ftirecek bir teknoloji olarak g\u00f6r\u00fclen veri \u00f6\u011frenme ve \u00e7\u0131kar\u0131m i\u015flemeyi daha da h\u0131zland\u0131rmak i\u00e7in bir GPU’nun \u00fczerine dikey olarak istiflenmi\u015f HBM \u00e7iplerini i\u00e7eriyor. \u015eu anda HBM \u00e7ipleri, 2.5D paketleme teknolojisi alt\u0131nda bir silikon interpozer \u00fczerinde GPU ile yatay olarak ba\u011flan\u0131yor.<\/p>\n

<\/span> 3D paketlemede ise silikon interpozer ya da \u00e7iplerin ileti\u015fim kurmas\u0131n\u0131 ve birlikte \u00e7al\u0131\u015fmas\u0131n\u0131 sa\u011flamak i\u00e7in \u00e7iplerin aras\u0131na yerle\u015ftirilen ince bir alt tabaka kullanmaya gerek duyulmuyor. Samsung, bu yeni paketleme teknolojisini SAINT-D<\/strong> (Samsung Advanced Interconnection Technology-D) olarak adland\u0131r\u0131yor. Yap\u0131lan a\u00e7\u0131klamalara g\u00f6re Samsung\u2019un 3D HBM paketlemeyi anahtar teslim olarak sunmas\u0131 bekleniyor. <\/figure>\n
<\/span> B\u00f6ylece Samsung\u2019un geli\u015fmi\u015f paketleme ekibi, bellek i\u015f b\u00f6l\u00fcm\u00fcnde \u00fcretilen HBM \u00e7iplerini, Samsung Foundry birimi taraf\u0131ndan monte edilen GPU’larla dikey olarak birbirine ba\u011flayacak. Bu da bir m\u00fc\u015fterinin istedi\u011fi t\u00fcm s\u00fcre\u00e7lerin tek bir \u00e7at\u0131 alt\u0131nda yap\u0131labilece\u011fi<\/strong> anlam\u0131na geliyor. \u00d6rne\u011fin TSMC tam olarak bunu yap\u0131yor. <\/figure>\n

Samsung\u2019a g\u00f6re 3D paketleme g\u00fc\u00e7 t\u00fcketimini ve i\u015flem gecikmelerini azaltarak<\/strong> yar\u0131 iletken \u00e7iplerin elektrik sinyallerinin kalitesini art\u0131racak. Bu arada Samsung, 2027 y\u0131l\u0131nda, yar\u0131 iletkenlerin veri aktar\u0131m h\u0131z\u0131n\u0131 \u00f6nemli \u00f6l\u00e7\u00fcde art\u0131ran optik unsurlar\u0131 tek bir birle\u015fik yapay zeka h\u0131zland\u0131r\u0131c\u0131 paketine dahil eden hepsi bir arada heterojen entegrasyon teknolojisini tan\u0131tmay\u0131 planl\u0131yor.<\/p>\n

Piyasa analistlerine g\u00f6re HBM’nin 2024\u2019te DRAM pazar\u0131n\u0131n y\u00fczde 21’ini olu\u015ftururken 2025 y\u0131l\u0131nda y\u00fczde 30’unu olu\u015fturmas\u0131 bekleniyor. 3D paketleme de dahil olmak \u00fczere geli\u015fmi\u015f paketleme pazar\u0131n\u0131n ise 2032\u2019de 80 milyar dolara, yani \u015fimdiye k\u0131yasla y\u00fczde 150\u2019lik bir at\u0131\u015f ya\u015famas\u0131 bekleniyor.<\/p>\n\n

Kaynak\u00a0 :\u00a0https:\/\/www.donanimhaber.com\/samsung-gelecek-yil-icin-hbm4-e-hazirlaniyor–178550<\/span><\/p>\n","protected":false},"excerpt":{"rendered":"

\u015eirket ve sekt\u00f6r kaynaklar\u0131na g\u00f6re Samsung, bu y\u0131l i\u00e7inde y\u00fcksek bant geni\u015flikli bellek (HBM) i\u00e7in \u00fc\u00e7 boyutlu (3D) paketleme hizmetlerini ba\u015flatmas\u0131 ve bu teknolojinin yeni nesil HBM4 belleklerde kullan\u0131lmas\u0131 bekleniyor. Samsung, bu noktada …<\/p>\n","protected":false},"author":1,"featured_media":60011,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[8],"tags":[2285,2284,175,506],"class_list":["post-60010","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-teknoloji","tag-cipleri","tag-paketleme","tag-samsung","tag-tek"],"_links":{"self":[{"href":"https:\/\/kamucalisani.net\/index.php\/wp-json\/wp\/v2\/posts\/60010","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/kamucalisani.net\/index.php\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/kamucalisani.net\/index.php\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/kamucalisani.net\/index.php\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/kamucalisani.net\/index.php\/wp-json\/wp\/v2\/comments?post=60010"}],"version-history":[{"count":1,"href":"https:\/\/kamucalisani.net\/index.php\/wp-json\/wp\/v2\/posts\/60010\/revisions"}],"predecessor-version":[{"id":60015,"href":"https:\/\/kamucalisani.net\/index.php\/wp-json\/wp\/v2\/posts\/60010\/revisions\/60015"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/kamucalisani.net\/index.php\/wp-json\/wp\/v2\/media\/60011"}],"wp:attachment":[{"href":"https:\/\/kamucalisani.net\/index.php\/wp-json\/wp\/v2\/media?parent=60010"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/kamucalisani.net\/index.php\/wp-json\/wp\/v2\/categories?post=60010"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/kamucalisani.net\/index.php\/wp-json\/wp\/v2\/tags?post=60010"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}