{"id":63362,"date":"2024-07-12T17:36:06","date_gmt":"2024-07-12T17:36:06","guid":{"rendered":"https:\/\/kamucalisani.net\/?p=63362"},"modified":"2024-07-12T17:36:06","modified_gmt":"2024-07-12T17:36:06","slug":"apple-m5-hem-maclerde-hem-de-yapay-zeka-sunucularina-guc-verecek","status":"publish","type":"post","link":"https:\/\/kamucalisani.net\/index.php\/2024\/07\/12\/apple-m5-hem-maclerde-hem-de-yapay-zeka-sunucularina-guc-verecek\/","title":{"rendered":"Apple M5 hem Mac\u2019lerde hem de yapay zeka sunucular\u0131na g\u00fc\u00e7 verecek"},"content":{"rendered":"

Apple<\/strong>‘\u0131n t\u00fcketici odakl\u0131 Mac<\/strong> bilgisayarlarla birlikte yapay zeka i\u00e7in sunuculara<\/strong> g\u00fc\u00e7 verecek bir \u00e7ipe sahip olmak istiyor. Aktar\u0131lanlara g\u00f6re Apple, gelecekteki M5 \u00e7ipi ile \u00e7ift y\u00f6nl\u00fc kullan\u0131ma<\/strong> eri\u015febilmek i\u00e7in TSMC\u2019nin geli\u015fmi\u015f SoIC<\/strong> paketleme teknolojisini kullanacak. Bu hem performans taraf\u0131na olumlu katk\u0131da bulunacak hem de Apple\u2019a esneklik sa\u011flayacak.<\/p>\n

Apple M5 hem Mac’lerde hem de sunucularda<\/b><\/p>\n

Apple M5<\/strong> \u00e7ipinin \u015fu anda SoIC teknolojisi \u00fczerinde \u00f6n deneme \u00fcretimi<\/strong> a\u015famas\u0131nda oldu\u011fu belirtiliyor. Seri \u00fcretimin ise 2025\u2019ten itibaren<\/strong> ba\u015flamas\u0131 bekleniyor. \u00c7ipin kullan\u0131c\u0131larla bulu\u015fmas\u0131 ise 2025 sonu veya 2026 y\u0131l\u0131nda \u00e7\u0131kacak \u00fcr\u00fcnlerle olacak. Hat\u0131rlanaca\u011f\u0131 \u00fczere Apple\u2019\u0131n sunucu taraf\u0131nda M2 Ultra ve M4\u2019ten yararlanaca\u011f\u0131 bildirilmi\u015fti. Ancak g\u00f6r\u00fcn\u00fc\u015fe g\u00f6re Apple\u2019\u0131n planlar\u0131 M5 \u00e7ipine kaym\u0131\u015f durumda.<\/p>\n

<\/span> TSMC, SoIC<\/strong> paketleme teknolojisini 2018 y\u0131l\u0131nda tan\u0131tm\u0131\u015ft\u0131. SoIC, k\u00fc\u00e7\u00fclt\u00fclm\u00fc\u015f boyut ve art\u0131r\u0131lm\u0131\u015f performans ile heterojen \u00e7ip entegrasyonu alan\u0131n\u0131 ilerletmeyi ama\u00e7l\u0131yor. Y\u00fcksek performans, d\u00fc\u015f\u00fck g\u00fc\u00e7 ve minimum RLC (diren\u00e7-end\u00fcktans-kapasitans) i\u00e7in ultra y\u00fcksek yo\u011funluklu dikey istifleme \u00f6zelli\u011fi ile \u00f6ne \u00e7\u0131kan SoIC, daha iyi form fakt\u00f6r\u00fc ve performans elde etmek i\u00e7in aktif ve pasif \u00e7ipleri, elektriksel olarak yerel SoC ile ayn\u0131 olan yeni bir entegre-SoC sistemiyle bir araya getiriyordu. <\/figure>\n
<\/span> Daha yal\u0131n bir anlat\u0131mla SoIC, \u00e7iplerin \u00fc\u00e7 boyutlu bir yap\u0131da istiflenmesini<\/strong> sa\u011flayarak daha iyi<\/strong> termal y\u00f6netim, daha az ak\u0131m ka\u00e7a\u011f\u0131 ve daha iyi elektrik performans\u0131<\/strong> sunuyor. <\/figure>\n

Son gelen bilgiler ise Apple\u2019\u0131n M5 \u00e7ipinde bu teknolojiyi kulland\u0131\u011f\u0131n\u0131 g\u00f6steriyor. Apple, M5 ayr\u0131ca g\u00fcncellenmi\u015f 11 in\u00e7 ve 13 in\u00e7 iPad Pro modellerine de koyacak. \u015eirketin yenilenen tabletlerinde bulunan versiyon i\u00e7in ayn\u0131 paketleme teknolojisini kullanmay\u0131 planlay\u0131p planlamad\u0131\u011f\u0131 net de\u011fil. Ancak, Apple’\u0131n ayn\u0131 silikonu birden fazla \u00fcr\u00fcn kategorisinde kullanarak muhtemelen maliyet noktas\u0131nda ciddi avantaj<\/strong> sa\u011flamak istiyor. \u015eu anda Apple Intelligence’\u0131n y\u0131l sonunda masa\u00fcst\u00fc Mac’ler i\u00e7in tasarlanm\u0131\u015f olan M2 Ultra destekli sunucular \u00fczerinde \u00e7al\u0131\u015fmas\u0131 bekleniyor.<\/p>\n\n

Kaynak\u00a0 :\u00a0https:\/\/www.donanimhaber.com\/apple-m5-hem-mac-lerde-hem-de-yapay-zeka-sunucularina-guc-verecek–179144<\/span><\/p>\n","protected":false},"excerpt":{"rendered":"

Apple’\u0131n t\u00fcketici odakl\u0131 Mac bilgisayarlarla birlikte yapay zeka i\u00e7in sunuculara g\u00fc\u00e7 verecek bir \u00e7ipe sahip olmak istiyor. Aktar\u0131lanlara g\u00f6re Apple, gelecekteki M5 \u00e7ipi ile \u00e7ift y\u00f6nl\u00fc kullan\u0131ma eri\u015febilmek i\u00e7in TSMC\u2019nin geli\u015fmi\u015f SoIC paketleme …<\/p>\n","protected":false},"author":1,"featured_media":63363,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[8],"tags":[82,3118,499],"class_list":["post-63362","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-teknoloji","tag-apple","tag-cipi","tag-performans"],"_links":{"self":[{"href":"https:\/\/kamucalisani.net\/index.php\/wp-json\/wp\/v2\/posts\/63362","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/kamucalisani.net\/index.php\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/kamucalisani.net\/index.php\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/kamucalisani.net\/index.php\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/kamucalisani.net\/index.php\/wp-json\/wp\/v2\/comments?post=63362"}],"version-history":[{"count":1,"href":"https:\/\/kamucalisani.net\/index.php\/wp-json\/wp\/v2\/posts\/63362\/revisions"}],"predecessor-version":[{"id":63366,"href":"https:\/\/kamucalisani.net\/index.php\/wp-json\/wp\/v2\/posts\/63362\/revisions\/63366"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/kamucalisani.net\/index.php\/wp-json\/wp\/v2\/media\/63363"}],"wp:attachment":[{"href":"https:\/\/kamucalisani.net\/index.php\/wp-json\/wp\/v2\/media?parent=63362"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/kamucalisani.net\/index.php\/wp-json\/wp\/v2\/categories?post=63362"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/kamucalisani.net\/index.php\/wp-json\/wp\/v2\/tags?post=63362"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}